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Electrogrip EGTEK21 :
We are manufacturer and supplier of Electrogrip EGTEK21 like Pre-welded Copper Bonded Rod, Earth Enhancing Compound, Earth Pit Cover And Conductive Gel.
Copper Bonded Rod is pre-welded with a connection clamp made of steel plate with 4 connection point.
Hydroscopic Conductive Gel is used to make a proper pit prior to the installation of electrode & Backfilling Compound.
Hygroscopic Conductive Gel is used to prepare the pit. Carbonaceous backfill compound is iuused with the electrode. The backfill compound is electrically conductive through flow of electrons (like in metals) and is not dependent on moisture. Electrogrip BFC is tested as per IEC 62561-7 and ASTM G57-06 for resistivity of 0.244 ohm-meter from National Test house (Govt. of India).
Readymade HDPP/HDPE Earth Pit Chamber with 4 output for accessing wire & strips. Light weight, Easy to Handle, Easy to install. Lockable from Top. The cover is tested at national Test House (Govt. of India) for a load bearing capasity of 8.89 tonnes.